Siemens Digital Industries Software announced that continued cooperation with Intel Foundry led to several product certifications, updated foundry reference flows and additional technology permit that use the leading technologies of the Foundry for the next generation (IC) and advanced packaging of the next generation.
Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance and enables a new and convincing solution for 3D -IC and chiplet offers for a width of the semiconductor market industry.
Intel 18a certification services
The NMplatform tool from Siemens' industry-leading caliber is now certified for the latest Intel 18A production process design kit (PDK). Intel 18a is an important technological leap forward with innovative transistors for the Ribbonfet goal and the first Powervia-Backside-Service Delief of the industry.
With this caliber certification, common customers can continue the Caliber-NMPLATFORM tool as an industry-standard subscription solution with the most advanced manufacturing process of Intel Foundry and accelerate the next generation chip designs.
Siemens and Intel Foundry have also successfully certified the software tools from Siemens' Solido Spice and Analog Fastspice (AFS) for the latest Intel 18a production PDK. Both tools represent important elements of the solemes' Solido Simulation Suite software, which is an extended portfolio of AI-Akkelerators for intelligent IC design and verification and the review of the feature-judge circuit check for analog, mixed signal, storage, library IP, 3D IC and system-A-chip design offers.
The Intel 18A process node is now also activated with Open Model Interface (OMI), the industry standard platform for the implementation of IC age modeling and reliability analyzes, which is supported by Siemens' Solido Simulation Suite.
Intel 18a Custom Reference Flow Enablement
Siemens 'caliber nmplatform and its AFS (analogous FASTSPICE) software (AFS), which is part of the Siemens' Solido Simulation Suite offers from Siemens, are now also activated via the Intel Foundry Custom Reference Flow (CRF). Mutual customers can now access Siemens' first-class simulation and the flow of cancellation for chipletes that extend up to 3D-IC designs.
Intel 18A-P and Intel 14a-e Enablement
In addition, the qualification of the offers from Siemens caliber NMPLATFORM and SOLIDO Simulation Suite for the Intel 18A-P process node is underway. Customers can request the latest Intel 18A-P-PDK for early design work and IP development.
In addition, both solutions are part of the Intel 14A-e process definition and design technology co-optimization (DTCO), with early runs already available. Intel 14a-e is expected to deliver an even higher density and performance per watt compared to the Intel 18A process node.
“At Intel Foundry we are building strategic alliances with industry leaders such as Siemens to deliver first -class design solutions for our customers,” said Suk Lee, VP and GM of the Office for Ecosystem Technology, Intel Foundry. “These powerful review and design tools are strictly tested to use the full skills of our advanced process nodes. By integrating Siemens expertise into our technology, we will not only optimize the design workflows, but also create ways for our mutual customers to market pioneering innovations faster and more efficiently.”
Milestones for advanced packaging cooperation
Siemens also announced the certification of a comprehensive reference workflow for Intel Foundry's embedded multi-the-interconnect-bridge-t (EMIB-T) through silicone via technology. The workflow is driven by Siemens' Innovator3D IC solution, which offers a consolidated cockpit for the construction of a digital twin with a uniform data model for design planning, prototyping and predictive analysis of the full semiconductor package.
The workflow supports complete detailed implementations and thermal analyzes of the analysis of the substrate, signal and performance integrity as well as the pack-assembly-design kit (PADK) Monday. The Siemens technologies certified in this flow of reference include Innovator3D IC, Kaliber NMDRC and NMLVS, Xepeditionpaket designer, Caliber 3dhermal, Hyperlynx Si/Pi and Caliber 3DSack.
Customers can request Intel Foundry's reference -flow kit for early adoption and design research.
The cooperation also has the availability of a prototype workflow for the embedded multi-the-interconnect bridge (EMIB) technology with the Siemens' Aprisa ™ software. The Aprisa technology from Siemens Aprisa was used to implement the power grid (PG) and the bump routing of the silicon -emib -cubes.
Finally, Siemens joined the Intel Foundry Accelerator Chiplet Alliance – the latest accelerator Alliance program with which the infrastructure for chiplet design, interoperability and safety requirements are important for today's complex systems in the areas of air and space travel, defense and business markets.
“As an industry leader in advanced packaging technologies, Siemens EDA is pleased as the original member of the New Intel Foundry Accelerator Chiplet Alliance,” said Juan C. Rey, Senior VP and GM, Calibre Product Line, Siemens Digital Industries Software.
“This alliance not only marks a significant milestone in our cooperation, but also brings our common customers an unprecedented value. Together we are ready to accelerate development cycles and to exceed the limits of semiconductor technology and to create groundbreaking solutions that meet the growing requirements of the industry.”