Huawei works with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3NM chip. The American tech giant, reports in 2026 to China's largest chip maker.
The Taiwan Economic daily newspaper Huawei moved to a GAA architecture (gate-around) used by Samsung Foundry and move away from traditional silicon designs.
The company is developing a so-called 3NM design based on carbon ducts with carbon nanor tubes and two-dimensional materials, the US chip and the AI analyst Ray Wang, which was dependent on X, citing internal sources near Huawei.
Wong added that the company has completed the laboratory validation of the 3NM chip, which is currently undergoing an adjustment of the production lines at SMIC.
The current list of Kirin processors and Ascend AI chips from Huawei are manufactured with the 7NM node technology.
SMIC is excluded from the importing of progressive extreme ultraviolet lithograph devices from ASML.
The common F&E initiative clearly shows that US trade sanctions did not comply with China's efforts to create a sustainable domestic chip sector that can produce advanced products.
Founder of the industrial blog Radio -free cell phone Richard Windsor, which was determined at the beginning of the month, such as the 7-NM process of Huawei, which has used multi-pattering technology and equipment for processes by 14 Nm, includes many further steps and is more complicated, with much lower yields than that of Taiwan Semiconductor manufacturing CO and other yields produced.
Jensen Huang, CEO of NVIDIA, recently recognized that the gap between us and Chinese chips narrowed, and last week the USA referred to the export of AI chips to China as a failure.
Last month, The Wall Street Journal Huawei plans to test the technical feasibility of a new Ascend chip, which is more powerful than the H100 chip from Nvidia, which was banned in China at the end of 2023.