Siemens and Samsung grow their cooperation with new solutions for the integrity of the energy, the innovation of silicon photonics and the review of the relification with mixed signal signal signal signal
Siemens Digital Industries software announced a significant expansion of their cooperation with Samsung Foundry, including the expansion of the certification for many of the most advanced process technologies in Samsung in the entire comprehensive EDA portfolio of Siemens (comprehensive electronic design automation).
These certifications include the most modern Finfet and MBCFET processes from Samsung-Anlicht 14 Nm to 2NM nodes (SF2/SF2P)-and enable common customers to use the Calibre® software from Siemens' Calibre®, Solido ™ software and aprisa ™ software.
In addition to the certification, companies have also presented new common innovations that help customers to cope with critical design challenges in terms of electricity integrity, silicon photonics, the checking relification of mixed signal verification and other important domains.
“Samsung Foundry is pleased to broaden our cooperation with Siemens, which further increases its value for the Samsung Foundry ecosystem by offering more functions to support our latest advanced process,” said Sungjae Lee, Vice President and Head of the -PDK development team at Samsung Electronics. “Our work with Siemens also goes beyond product certifications in order to record a variety of innovative new common solutions with which our common customers can differentiate and win some of the world's strongest growing industries.”
Advanced node qualifications for Siemens' caliber, Solido and Aprisa
The product lines from Siemens EDA were recently qualified for use with Samsung's latest Finfet and MBCFET processes, including 14 Nm to 2nm nodes (SF2/SF2P).
These Siemens EDA product lines contain the following:
- Caliber nmplatform For checking the integrated circuit (IC); And Caliber design chancerthat takes over the rules of the Samsung Foundry and automatically performs layout optimization tasks that improve the designs of the customers.
- Solido simulation suiteincluding Solid spice And Analog FastSpice (AFS) Platform for the spice accuracy of analog, RF and 3D-IC designs and Fixed (Libspice) For spice-accuracy-batch check of the Bibibibicaus-IP and memory bitcell designs. In addition, Solido Spice and AFS are expanding the support for the industry standard Open Model Interface (OMI) about the processes of Samsung Foundry from 14 Nm to 2nm to enable aging modeling and reliability analysis.
- Fast For digital implementation with proven correlation with Caliber coating tools and support for all design rules and features of the Advanced Process Technology platforms from Samsung Foundry.
- In addition, Kaliber and Solido are qualified for Samsung's latest, fully exhausted process technologies for isolator (FD-Soi), including 18fDs and higher.
“Since the landscape of integrated design and production becomes increasingly dynamic, the cooperation between industrial partners for fulfilling complex customer needs becomes crucial,” said Juan C. Rey, Senior Vice President and General Manager of the Caliber Product Line from Siemens Digital Industries Software. “Our cooperation with Samsung Foundry illustrates this collaborative spirit, in which we jointly advance the advantages of 3D-IC architectures and other latest technologies. We can enable this progress in connection with a number of new EDA product certificates and innovative design strategies in the EDA products and innovative strategies, in the global, global markets of detailed global To train markets. ” “
The collaboration between Siemens and Samsung Foundry also extends to the joint study and the creation of several new joint solutions to address some of the most urgent challenges in the semiconductor industry, including:
- Postponed the potential of silicon photonics – Siemens and Samsung jointly developed innovative photonic verification techniques through modifications to existing tool sets. DRC software from Siemens of caliber equations can apply complex checks in order to eliminate incorrect mistakes in curved segments that are common in silicon photonics. Siemens recognized the complexity of Foundry-Regeleck modifications and developed an innovative approach with the help of Caliber Auto-Waviver software in order to filter out incorrect violations automatically and only report real problems.
- Automated layout modification addressed hotspots that were identified by EM/IR analyzes: Siemens and Samsung have developed an advanced automated layout modification solution using Caliber Destenhancer software that integrates comprehensive DRC specialist knowledge with intelligent layout adjustments to fix hotspots from EM/IR -Analysis and to deliver results. The solution offers options such as de about the minimization of the IR drops, the DE -PGE to optimize power structures to achieve EM/IR targets, and the PVR for an efficient introduction of DCAP and filling cells, which significantly shortens the physical checking time.
- Siemens' Tessent ™ Design for Test (DFT) teams (with Samsung Foundry for activating Advanced process test and diagnosis using Siemens Tessent Diagnosis and Hi-Res-chain software. New defects in complex production require effective screening and understanding of defects. The predictive approach of Samsung Foundry for screen defects, the combination of Tessent tests and diagnosis increases the defect forecast dramatically and significantly reduces the test costs. Tessentent-cell-conscious test was significantly increased by the defect cover; And Hi-res chain diagnosis further improved the diagnosis resolution through the rapid identification of hidden systematic defects. This cooperation for learning the yield focuses on error models for extended processes used on the latest semiconductor devices.
- Multi-the-die innovations for through-of-one about (TSV) and Silicon Interposer-based designs: The most recent collaboration between Siemens and Samsung focused on the orientation of Siemens' Innovator3d ™ IC solution, a platform for planning, simulation and verification of multi-hesky, with the developing heterogeneous integration method from Samsung. The efforts included the development of new checks to check the inter-chip antenna effects and the electrostatic discharge (ESD) with advanced features of the caliber 3D stack solution as well as the automation of the Kaliber-3DSP-SP-XACT flows, the parasitic efficiency, the efficiency of cross multi-the efficiency, the accuracy and consistency, in particular to improve for the 2.5 D design implementation of TSV and interposer basis.
- The partners worked together Experiments with the SVDB of LVS runs and spice models to calculate the variations of threshold tension and mobility for each device Based on the parameter values of the local layout effects (LLE). The use of this approach to identify failed devices without the execution of simulation after the layout has proven to be effective when recognizing real problems during the design phase, especially in standard cells and analog designs. It has won a significant traction of Samsung design teams and is already supported for many process nodes from 14 Nm to 2NM.
New reference flows for mutual customers. Siemens' Solido Custom Ic team and the Samsung Foundry have worked together to create several new reference flows in order to enable mutual customers with extended methods and methods with extended methods. This includes:
- The Solido Simulation Suite shows analog circuit review flows with solido spice and AFS using transient and RF analyzes as well as the standard cell check with solido-LibSpice software using the Monte-Carlo transient analysis.
- The Solido design environment shows a variation-conscious check flow at the spice level, including samples, the Monte Carlo, extraction with high sigma, design sensitivity and optimization.
- Solido Characterization Suite software, Die .Lib production with Solido -Generator and .LIB -examination and analysis using Solido analysis.
- Solido IP validation Suite shows the IP-QA of the production of broadcast quality for in-view, cross view and version version validation.
Siemens Digital Industries Software Help organizations of all sizes help digitally using software, hardware and services of the Siemens Xcelerator Business Platform digitally. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes in order to transform today's ideas into the sustainable products of the future. From chips to entire systems, from product to processes, in all industries. Siemens Digital Industries software – acceleration of the transformation.
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